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ADS now has Intelligent Layout Interconnect to dramatically improve RF physical design
and editing. New structures make pin-to-pin routing and modifying RF interconnects efficient,
intuitive, and easy. For example, new power and ground planes automatically generate clearances
including thermal relief for board applications. And, single and multilayer interconnects route
intelligently, vias easily insert and auto-size, and when editing, the layout simplifies by
automatically consolidating and removing unneeded components.